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DOUBLE-SIDE WAFER SCRUBBING BEYOND POST-CMP CLEANING

Author(s):
Publication title:
Proceedings of the Fourth International Symposium on Cleaning Technology in Semiconductor Device Manufacturing
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
95-20
Pub. Year:
1995
Page(from):
409
Page(to):
420
Pages:
12
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771153 [1566771153]
Language:
English
Call no.:
E23400/962140
Type:
Conference Proceedings

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