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IMPACT OF THE ELECTROCHEMICAL PROPERTIES OF SILICON WAFER SURFACES ON COPPER OUTPLATING FROM HF SOLUTIONS

Author(s):
Teerlinck, I.
Schmidt, H.F.
Rotondaro, A.L.P.
Hurd, T.Q.
Mouche, L.
Mertens, P.W.
Meuris, M.
Heyns, M.M.
Vanhaeren, D.
Vandervorst, W.
5 more
Publication title:
Proceedings of the Fourth International Symposium on Cleaning Technology in Semiconductor Device Manufacturing
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
95-20
Pub. Year:
1995
Page(from):
284
Page(to):
291
Pages:
8
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771153 [1566771153]
Language:
English
Call no.:
E23400/962140
Type:
Conference Proceedings

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