An Investigation of Corner Rounding to Strengthen Silicon Micromachined Pressure Sensor for Fusion-Bonded Wafers

An Investigation of Corner Rounding to Strengthen Silicon Micromachined Pressure Sensor for Fusion-Bonded Wafers

Author(s):

Publication title:

Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

95-7

Pub. Year:

1995

Page(from):

528

Page(to):

534

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566771016 [1566771013]

Language:

English

Call no.:

E23400/952067

Type:

Conference Proceedings

Details

TDL ID:	ZA00013814
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Semiconductor Wafer Bonding
Conf. info. (Number):	3rd
Conf. info. (Venue):	Reno, Nevada, USA
Conf. info. (Date):	1995.00.00

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