Blank Cover Image

Oxygen Precipitate Distribution in Bonded SOI Wafers

Author(s):
Publication title:
Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
95-7
Pub. Year:
1995
Page(from):
290
Page(to):
295
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771016 [1566771013]
Language:
English
Call no.:
E23400/952067
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Defects induced by heavy-metal on bonded SOI wafer surfaces

Okonogi, K., Kikuchi, H., Arai, K.

Electrochemical Society
7 Conference Proceedings Device Applications Using Bonded SOI Wafers

Fujino, S., Himi, H., Fukada, T., Yamaguchi, H.(Invited)

Electrochemical Society
2 Conference Proceedings Device Applications Using Bonded Thick SOI Wafers

Fujino, S., Takahashi, S., Fukada, T., Himi, H., Kawamoto, K.

Electrochemical Society
8 Conference Proceedings Oxidation Induced Crystalline Defects in Bonded SOI Wafers

Papakonstantinou, P., Somasundram, K., Cao, X., Quinn, C., Yallup, K., Nevin, W.A., Blackstone, S.

Electrochemical Society
3 Conference Proceedings Reduction of Defects in Thin Bonded Silicon on Insulator (SOI) Wafers

Aga, H., Mitani, K., Kobayashi, N.

Electrochemical Society
9 Conference Proceedings High Volume Manufacturing of SOI Bonded Wafers

Easter, W.G, Goodwin, C.A., Hsieh, C.M., Shanaman, R.H., Wallace, S.W., Worrell, M.J.

Electrochemical Society
4 Conference Proceedings Photoluminescence of Ring-Distribution of Oxygen Precipitates in Czochralski Silicon

Terashima,K., Ikarashi,T., Ono,H., Tajima,M.

Trans Tech Publications
10 Conference Proceedings SOI Wafers with Buried Cavities

Suni, T., Henttinen, K., Dekker, J., Luoto, H., Kulawski, M., Makinen, J., Mutikainen, R.

Electrochemical Society
5 Conference Proceedings Recent Bonded SOI Wafer Thinning Results with Etch Rate Feedback

Neuner, J.W., Walsh, J.H., Mathur, D.P., Poultney, S.K.

Electrochemical Society
11 Conference Proceedings Preparation of Bonded Wafer Pairs

Reiche, M., Priewasser, K.H., Wittenzellner, E., Nauert, P., Nadrag, W.

Electrochemical Society
6 Conference Proceedings Automotive Semiconductor Devices Using Bonded SOI Wafers

S. Fujino, H. Himi

Electrochemical Society
12 Conference Proceedings Boron Present in the Interface of Bonded SOI Wafers and its Protection Method

Mitani, K., Katayama, M., Nakazawa, K.

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12