The Design of a Test Chip for a Sematech Program to Standardize Electromigration Testing
- Author(s):
- Publication title:
- Proceedings of the Symposium on Reliability of Metals in Electronics
- Title of ser.:
- Electrochemical Society Proceedings Series
- Ser. no.:
- 95-3
- Pub. Year:
- 1995
- Page(from):
- 116
- Page(to):
- 125
- Pub. info.:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566770972 [1566770971]
- Language:
- English
- Call no.:
- E23400/952063
- Type:
- Conference Proceedings
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