Through-pitch low-k1 contact hole imaging with CPL technology

Through-pitch low-k1 contact hole imaging with CPL technology

Author(s):

Wiaux, V. ( IMEC (Belgium) )

Bekaert, J. ( IMEC (Belgium) )

Chen, J.F. ( ASML MaskTools, Inc. (USA) )

Hsu, S.D. ( ASML MaskTools, Inc. (USA) )

Ronse, K.G. ( IMEC (Belgium) )

Socha, R.J. ( ASML Technology Development Ctr. (USA) )

Vandenberghe, G. ( IMEC (Belgium) )

Van Den Broeke, D.J. ( ASML MaskTools, Inc. (USA) )

3 more

Publication title:

Photomask and Next-Generation Lithography Mask Technology XI

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5446

Pub. Year:

2004

Page(from):

585

Page(to):

594

Pages:

10

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819453693 [0819453692]

Language:

English

Call no.:

P63600/5446.2

Type:

Conference Proceedings

Details

TDL ID:	ZA00013799
Series ID:	PA00000029
Conf. info. (Name):	Photomask and Next-Generation Lithography Mask Technology
Conf. info. (Number):	2004 : 11th
Conf. info. (Venue):	Yokohama, Japan
Conf. info. (Date):	2004.04.14-2004.04.16

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