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Mask patterning process using the negative tone chemically amplified resist TOK OEBR-CAN024

Author(s):
Irmscher, M. ( IMS Chips (Germany) )
Beyer, D. ( Leica Microsystems Lithography GmbH (Germany) )
Butschke, J. ( IMS Chips (Germany) )
Hudek, P. ( Leica Microsystems Lithography GmbH (Germany) )
Koepernik, C. ( IMS Chips (Germany) )
Plumhoff, J. ( Unaxis USA, Inc. (USA) )
Rausa, E. ( Unaxis USA, Inc. (USA) )
Sato, M. ( Tokyo Ohka Kogyo Co., Ltd. (Japan) )
Voehringer, P. ( IMS Chips (Germany) )
4 more
Publication title:
Photomask and Next-Generation Lithography Mask Technology XI
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5446
Pub. Year:
2004
Page(from):
46
Page(to):
57
Pages:
12
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819453693 [0819453692]
Language:
English
Call no.:
P63600/5446.1
Type:
Conference Proceedings

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