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Disbond detection in adhesively bonded structures using piezoelectric wafer active sensors

Author(s):
Publication title:
Health monitoring and smart nondestructive evaluation of structural and biological systems III : 15-17 March 2004, San Diego, California, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5394
Pub. Year:
2004
Page(from):
66
Page(to):
77
Pages:
12
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819453112 [0819453110]
Language:
English
Call no.:
P63600/5394
Type:
Conference Proceedings

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