Mathematically describing the target contour in silicon such that model-based OPC can best realize design intent

Mathematically describing the target contour in silicon such that model-based OPC can best realize design intent

Author(s):

Cork, C.M. ( Synopsys SARL (France) )
Balasingam, P. ( Synopsys, Inc. (USA) )
Sandvik, S. ( Synopsys, Inc. (USA) )
Kielhorn, B. ( Synopsys, Inc. (USA) )
Rieger, M.L. ( Synopsys, Inc. (USA) )

Publication title:

Design and process integration for microelectronic manufacturing II [sic] : 26-27 February 2004, Santa Clara, California, USA

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5379

Pub. Year:

2004

Page(from):

214

Page(to):

223

Pages:

10

Pub. info.:

Bellingham, Wash., USA: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819452924 [0819452920]

Language:

English

Call no.:

P63600/5379

Type:

Conference Proceedings

Details

TDL ID:	ZA00013731
Series ID:	PA00000029
Conf. info. (Name):	SPIE Advanced Lithography : Design and process integration for microelectronic manufacturing
Conf. info. (Number):	2004 : 2nd
Conf. info. (Venue):	Santa Clara, CA, USA
Conf. info. (Date):	2004.02.26-2004.02.27

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