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Key challenges in across-pitch 0.33-k1 trench patterning using hybrid mask

Author(s):
Singh, N. ( Institute of Microelectronics (Singapore) )
Mukherjee-Roy, M. ( Institute of Microelectronics (Singapore) )
Mehta, S.S. ( Institute of Microelectronics (Singapore) )
Suda, H. ( HOYA Corp. (Japan) )
Kubota, T. ( HOYA Corp. (Japan) )
Kimura, Y. ( HOYA Corp. (Japan) )
Kinoshita, H. ( HOYA Corp. (Japan) )
2 more
Publication title:
Optical Microlithography XVII
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5377
Pub. Year:
2004
Page(from):
1334
Page(to):
1341
Pages:
8
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819452900 [0819452904]
Language:
English
Call no.:
P63600/5377.3
Type:
Conference Proceedings

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