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Influence of backbone chemistry on the post-exposure bake temperature sensitivity of 193-nm photoresists

Author(s):
Bae, Y.C. ( Rohm and Haas Electronic Materials (USA) )
Ogawa, T. ( Rohm and Haas Electronic Materials (USA) )
Kavanagh, R.J. ( Rohm and Haas Electronic Materials (USA) )
Kobayashi, T. ( Rohm and Haas Electronic Materials (USA) )
Lindsay, T. ( Rohm and Haas Electronic Materials (USA) )
Tanaka, T. ( Rohm and Haas Electronic Materials (USA) )
Xu, C.B. ( Rohm and Haas Electronic Materials (USA) )
Orsula, G. ( Rohm and Haas Electronic Materials (USA) )
DeSisto, J. ( Rohm and Haas Electronic Materials (USA) )
Hellion, M. ( Rohm and Haas Electronic Materials (USA) )
5 more
Publication title:
Advances in Resist Technology and Processing XXI
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5376
Pub. Year:
2004
Page(from):
1123
Page(to):
1130
Pages:
8
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819452894 [0819452890]
Language:
English
Call no.:
P63600/5376.2
Type:
Conference Proceedings

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