Influence of backbone chemistry on the post-exposure bake temperature sensitivity of 193-nm photoresists
- Author(s):
Bae, Y.C. ( Rohm and Haas Electronic Materials (USA) ) Ogawa, T. ( Rohm and Haas Electronic Materials (USA) ) Kavanagh, R.J. ( Rohm and Haas Electronic Materials (USA) ) Kobayashi, T. ( Rohm and Haas Electronic Materials (USA) ) Lindsay, T. ( Rohm and Haas Electronic Materials (USA) ) Tanaka, T. ( Rohm and Haas Electronic Materials (USA) ) Xu, C.B. ( Rohm and Haas Electronic Materials (USA) ) Orsula, G. ( Rohm and Haas Electronic Materials (USA) ) DeSisto, J. ( Rohm and Haas Electronic Materials (USA) ) Hellion, M. ( Rohm and Haas Electronic Materials (USA) ) - Publication title:
- Advances in Resist Technology and Processing XXI
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 5376
- Pub. Year:
- 2004
- Page(from):
- 1123
- Page(to):
- 1130
- Pages:
- 8
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819452894 [0819452890]
- Language:
- English
- Call no.:
- P63600/5376.2
- Type:
- Conference Proceedings
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