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Inorganic Bi/In thermal resist as a high-etch-ratio patterning layer for CF4/CHF3/O2 plasma etch

Author(s):
Publication title:
Advances in Resist Technology and Processing XXI
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5376
Pub. Year:
2004
Page(from):
867
Page(to):
878
Pages:
12
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819452894 [0819452890]
Language:
English
Call no.:
P63600/5376.2
Type:
Conference Proceedings

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