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Developer-soluble gap fill materials for patterning metal trenches in via-first dual-damascene process

Author(s):
Bhave, M. ( Brewer Science, Inc. (USA) )
Edwards, K. ( Brewer Science, Inc. (USA) )
Washburn, C.A. ( Brewer Science, Inc. (USA) )
Takei, S. ( Nissan Chemical Industries, Ltd. (Japan) )
Sakaida, Y. ( Nissan Chemical Industries, Ltd. (Japan) )
Nakajima, Y. ( Nissan Chemical Industries, Ltd. (Japan) )
1 more
Publication title:
Advances in Resist Technology and Processing XXI
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5376
Pub. Year:
2004
Page(from):
640
Page(to):
647
Pages:
8
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819452894 [0819452890]
Language:
English
Call no.:
P63600/5376.2
Type:
Conference Proceedings

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