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Spectroscopic ellipsometry-based scatterometry for depth and linewidth measurements of polysilicon-filled deep trenches

Author(s):
Hingst, T. ( Infineon Technologies AG (Germany) )
Moert, M. ( Infineon Technologies AG (Germany) )
Reinig, P. ( Infineon Technologies AG (Germany) )
Backen, E. ( Infineon Technologies AG (Germany) )
Dost, R. ( Infineon Technologies AG (Germany) )
Weidner, P. ( Infineon Technologies AG (Germany) )
Hopkins, J. ( KLA-Tencor Corp. (USA) )
Dziura, T.G. ( KLA-Tencor Corp. (USA) )
Elazami, A. ( KLA-Tencor Corp. (USA) )
Freed, R. ( KLA-Tencor Corp. (USA) )
5 more
Publication title:
Metrology, Inspection, and Process Control for Microlithography XVIII
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5375
Pub. Year:
2004
Page(from):
587
Page(to):
596
Pages:
10
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819452887 [0819452882]
Language:
English
Call no.:
P63600/5375.1
Type:
Conference Proceedings

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