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First via-hole TEG fabricated by using 90-nm CMOS technology and proximity electron lithography: electric and lithographic results

Author(s):
Kitagawa, T. ( Sony Corp. (Japan) )
Yoshizawa, M. ( Sony Corp. (Japan) )
Iwase, K. ( Sony Corp. (Japan) )
Omori, S. ( Sony Corp. (Japan) )
Nohama, S. ( Sony Corp. (Japan) )
Nakano, H. ( Sony Corp. (Japan) )
Moriya, S. ( Sony Corp. (Japan) )
Kawahira, H. ( Sony Corp. (Japan) )
3 more
Publication title:
Emerging Lithographic Technologies VIII
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5374
Pub. Year:
2004
Page(from):
537
Page(to):
545
Pages:
9
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819452870 [0819452874]
Language:
English
Call no.:
P63600/5374.2
Type:
Conference Proceedings

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