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Cost-effective packaging of laser modules using LTCC substrates

Author(s):
Keraenen, K. ( VTT Electronics (Finland) )
Maekinen, J.-T. ( VTT Electronics (Finland) )
Heilala, J. ( VTT Industrial Systems (Finland) )
Vaeaetaeinen, O. ( VTT Industrial Systems (Finland) )
Kautio, K. ( VTT Electronics (Finland) )
Ollila, J. ( VTT Electronics (Finland) )
Petaejae, J. ( VTT Electronics (Finland) )
Karppinen, M. ( VTT Electronics (Finland) )
Heikkinen, V. ( VTT Electronics (Finland) )
Karioja, P. ( VTT Electronics (Finland) )
5 more
Publication title:
Photonics Packaging and Integration IV
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5358
Pub. Year:
2004
Page(from):
111
Page(to):
121
Pages:
11
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819452665 [0819452661]
Language:
English
Call no.:
P63600/5358
Type:
Conference Proceedings

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