Thermal management of LEDs: package to system
- Author(s):
- Arik, M. ( GE Global Research Ctr. (USA) )
- Becker, C.A. ( GE Global Research Ctr. (USA) )
- Weaver, S.E. ( GE Global Research Ctr. (USA) )
- Petroski, J. ( GELcore LLC (USA) )
- Publication title:
- Third international conference on solid state lighting : 5-7 August 2003, San Diego, California, USA
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 5187
- Pub. Year:
- 2004
- Page(from):
- 64
- Page(to):
- 75
- Pages:
- 12
- Pub. info.:
- Bellingham, Wash., USA: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819450609 [081945060X]
- Language:
- English
- Call no.:
- P63600/5187
- Type:
- Conference Proceedings
Similar Items:
SPIE - The International Society of Optical Engineering |
7
Conference Proceedings
Thermal modeling and performance of LED packaging for illuminating device [6337-48]
SPIE - The International Society of Optical Engineering |
2
Conference Proceedings
Thermal challenges facing new-generation light-emitting diodes (LEDs) for lighting applications
SPIE-The International Society for Optical Engineering |
SPIE - The International Society of Optical Engineering |
American Society of Mechanical Engineers |
SPIE - The International Society of Optical Engineering |
SPIE - The International Society of Optical Engineering |
Society of Vacuum Coaters |
Society of Photo-optical Instrumentation Engineers |
11
Conference Proceedings
Lithography performance of contact holes:I.Optimization of Pattern fidelity using MPG and MPG-II
SPIE - The International Society for Optical Engineering |
SPIE - The International Society of Optical Engineering |
Society of Photo-optical Instrumentation Engineers |