Improved AlNi Ohmic Contacts to p-Type SiC

Improved AlNi Ohmic Contacts to p-Type SiC

Author(s):

Publication title:

Silicon carbide and related materials 2003 : ICSCRM, 2003 : proceedings of the 10th International Conference on Silicon Carbide and Related Materials 2003, Lyon, France, October 5-10, 2003

Title of ser.:

Materials science forum

Ser. no.:

457-460

Pub. Year:

2004

Page(from):

841

Page(to):

844

Pages:

4

Pub. info.:

Uetikon-Zuerich: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878499434 [0878499431]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00013364
Series ID:	PA00000012
Conf. info. (Name):	ICSCRM : Intenational Conference on Silicon Carbide and Related Materials
Conf. info. (Number):	2003 : 10th
Conf. info. (Venue):	Lyon, France
Conf. info. (Date):	2003.10.05-2003.10.10

Similar Items:

1 Conference Proceedings Ti/AlNi/W and Ti/Ni2Si/W Ohmic Contacts to P-Type SiC Tsao, B.H., Lawson, J., Scofield, J.D. Trans Tech Publications	7 Conference Proceedings Accurate CsM+ SIMS Aluminum Dopant Profiling in SiC Smith, H.E., Tsao, B.H., Scofield, J.D. Trans Tech Publications
2 Conference Proceedings TEM Observations of Ti/AlNi/Au Contacts on p-Type 4H-SiC B.H. Tsao, J.W. Lawson, J.D. Scofield, J.F. Baca Trans Tech Publications	8 Conference Proceedings Composite Ohmic Contacts to SiC Adedeji, A.V., Ahyi, A.C., Williams, J.R., Bozack, M.J., Mohney, S.E., Liu, B., Scofleld, J.D. Trans Tech Publications
3 Conference Proceedings Ti/AlNi/W Ohmic Contacts to P-Type SiC Bang-Hung Tsao, Jacob Lawson, James Scofield Materials Research Society	9 Conference Proceedings 3D Thermal Stress Model for SiC Power Modules B.H. Tsao, J. Lawson, J.D. Scofield, C. Laing, J. Brown Trans Tech Publications
4 Conference Proceedings Thermal Stability in Vacuum and in Air of Al/Ni/W Based Ohmic Contacts to p-Type SiC Liu, S., Potts, G., Scofield, J. Trans Tech Publications	10 Conference Proceedings Ohmic Contacts to P-Type Epitexial and Imlanted 4H-SiC Crofton, J., Williams, J.R., Adedeji, A.V., Scofield, J.D., Dhar, S., Feldman, L.C., Bozack, M.J. Trans Tech Publications
5 Technical Paper Temperature and Thickness Dependence of Ti/AiNi/W and Ti/Ni2Si/W Ohmic Contacts to P-Type SiC Tsao, B., Lawson, J., Scofield, J. American Institute of Aeronautics and Astronautics	11 Conference Proceedings Titanium-Based Ohmic Contact on p-Type 4H-SiC Jung, K.H., Cho, N.I., Lee, J.H., Yang, S.J., Kim, C.K., Lee, B.-T., Rim, K.H., Kim, N.-K., Kim, E.-D. Trans Tech Publications
6 Conference Proceedings Ohmic Contacts to p-Typo SiC with Impreved Thermal Stability Liu,S., Scofield,J.D. Trans Tech Publications	12 Conference Proceedings Titanium-Based Ohmic Contact on p-Type 4H-SiC Jung, K.H., Cho, N.I., Lee, J.H., Yang, S.J., Kim, C.K., Lee, B.-T., Rim, K.H., Kim, N.-K., Kim, E.-D. Trans Tech Publications

1

2

3

4

5

6

7

8

9

10

11

12