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The Effect of Grain Boundary Characteristics on Microstructure and Stress Void Evolution in Electroplated and Sputtered Cu Films

Author(s):
Publication title:
THERMEC '2003 : International Conference on Processing & Manufacturing of Advanced Materials, July 7-11, 2003, Leganés, Madrid, Spain
Title of ser.:
Materials science forum
Ser. no.:
426-432
Pub. Year:
2003
Pt.:
4
Page(from):
3481
Page(to):
3486
Pages:
6
Pub. info.:
Zuerich-Uetikon, Switzerland: Trans Tech Publications
ISSN:
02555476
ISBN:
9780878499199 [0878499199]
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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