Evaluation of Ligand Binding to Type 1 Collagen through Computational and Analytical Methods

Evaluation of Ligand Binding to Type 1 Collagen through Computational and Analytical Methods

Author(s):

Publication title:

THERMEC '2003 : International Conference on Processing & Manufacturing of Advanced Materials, July 7-11, 2003, Leganés, Madrid, Spain

Title of ser.:

Materials science forum

Ser. no.:

426-432

Pub. Year:

2003

Pt.:

4

Page(from):

3061

Page(to):

3066

Pages:

6

Pub. info.:

Zuerich-Uetikon, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878499199 [0878499199]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00013346
Series ID:	PA00000012
Conf. info. (Name):	THERMEC : International Conference on Processing & Manufacturing of Advanced Materials
Conf. info. (Number):	2003
Conf. info. (Venue):	Leganés, Madrid, Spain
Conf. info. (Date):	2003.07.07-2003.07.11

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