Stress Development in Ni/C-Multilayers on Si-Substrates with Increasing Period Number

Stress Development in Ni/C-Multilayers on Si-Substrates with Increasing Period Number

Author(s):

Publication title:

ECRS 6 : proceedings of the 6th European Conference on Residual Stresses, Coimbra, Portugal, 10-12 July, 2002

Title of ser.:

Materials science forum

Ser. no.:

404-407

Pub. Year:

2002

Page(from):

797

Page(to):

802

Pages:

6

Pub. info.:

Uetikon-Zuerich, Switzerland: Trans Tech Publications

ISSN:

02555476

ISBN:

9780878499007 [0878499008]

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00013337
Series ID:	PA00000012
Conf. info. (Name):	European Conference on Residual Stresses - ECRS
Conf. info. (Number):	6th
Conf. info. (Venue):	Coimbra, Portugal
Conf. info. (Date):	2002.07.10-2002.07.12

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