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Changes in Stress and Microstructure in Sputter Deposited Copper Films Due to Substrate Surface Effects

Author(s):
Publication title:
ECRS 6 : proceedings of the 6th European Conference on Residual Stresses, Coimbra, Portugal, 10-12 July, 2002
Title of ser.:
Materials science forum
Ser. no.:
404-407
Pub. Year:
2002
Page(from):
691
Page(to):
696
Pages:
6
Pub. info.:
Uetikon-Zuerich, Switzerland: Trans Tech Publications
ISSN:
02555476
ISBN:
9780878499007 [0878499008]
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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