The Analysis on the Fatigue Life of Flip Chip Package Under Cyclic Thermo-Mechanical Loading
- Author(s):
- Jong, W.R. ( Chung Yuan Christian University )
- Chiu, C.C. ( Chung Yuan Christian University )
- Tsai, H. ( Chung Yuan Christian University )
- Chen, S.C. ( Chung Yuan Christian University )
- Publication title:
- ANTEC 2004, 62nd annual technical conference, Chicago, IL, May 16-20, 2004
- Title of ser.:
- Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
- Ser. no.:
- 62
- Pub. Year:
- 2004
- Page(from):
- 1694
- Page(to):
- 1698
- Pages:
- 5
- Pub. info.:
- Brookfield Center, Conn.: Society of Plastics Engineers
- ISBN:
- 9780975370704 [0975370707]
- Language:
- English
- Call no.:
- S42700/62-2
- Type:
- Conference Proceedings
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