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Molding Analysis for Underfill of Flip-Chip Packages

Author(s):
Jong, W.R. ( Chung Yuan Christian University )
Chen, S.C. ( Chung Yuan Christian University )
Lai, C.C. ( Chung Yuan Christian University )
Kuo, T.H. ( Chung Yuan Christian University )
Liu, H.W. ( Chung Yuan Christian University )
Ho, S. ( Ta Hwa Institute of Technology )
Lo, W.Y. ( Ta Hwa Institute of Technology )
2 more
Publication title:
ANTEC 2004, 62nd annual technical conference, Chicago, IL, May 16-20, 2004
Title of ser.:
Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
Ser. no.:
62
Pub. Year:
2004
Page(from):
1689
Page(to):
1693
Pages:
5
Pub. info.:
Brookfield Center, Conn.: Society of Plastics Engineers
ISBN:
9780975370704 [0975370707]
Language:
English
Call no.:
S42700/62-2
Type:
Conference Proceedings

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