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Three-Dimensional CAE of Wire-Sweep in Microchip Encapsulation

Author(s):
Yang, W.H. ( CoreTech )
Hsu, D. ( CoreTech )
Yang, V. ( CoreTech )
Chang, R.Y. ( National Tsing-Hua University )
Su, F. ( ChipMOS )
Huang, S.J. ( National Chen Kung University )
Juang, S. ( National Chen Kung University )
2 more
Publication title:
ANTEC 2004, 62nd annual technical conference, Chicago, IL, May 16-20, 2004
Title of ser.:
Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
Ser. no.:
62
Pub. Year:
2004
Page(from):
1679
Page(to):
1683
Pages:
5
Pub. info.:
Brookfield Center, Conn.: Society of Plastics Engineers
ISBN:
9780975370704 [0975370707]
Language:
English
Call no.:
S42700/62-2
Type:
Conference Proceedings

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