Blank Cover Image

Rapid Thermal Response (RTR) Hot Embossing of Micro-Structures

Author(s):
Publication title:
ANTEC 2004, 62nd annual technical conference, Chicago, IL, May 16-20, 2004
Title of ser.:
Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
Ser. no.:
62
Pub. Year:
2004
Page(from):
933
Page(to):
936
Pages:
4
Pub. info.:
Brookfield Center, Conn.: Society of Plastics Engineers
ISBN:
9780975370704 [0975370707]
Language:
English
Call no.:
S42700/62-1
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Rapid Thermal Response Molding for Cycle Time Reduction

Yao, D., Kim, B.H.

Society of Plastics Engineers
7 Conference Proceedings Long Wavelength Shifting and Broadening of Quantum Well Infrared Photodetector Response via Rapid Thermal Annealing

Sengupta, D. K., Fang, W., Malin, J. I., Kuo, H. C., Horton, T., Curtis, A., Gardner, N. F., Flachsbart, B., Wohlmuth, …

MRS - Materials Research Society
2 Conference Proceedings Simulation of Squeezing Flow during Hot Embossing of Polymer Microstructures

Virupaksha, V., Yao, D., Kim, B.

Society of Plastics Engineers
8 Conference Proceedings Hot-embossed polymeric optical waveguides (Invited Paper)

Choi, C. -G., Kim, J. -T., Han, S. -P., Ahn, S. -H.

SPIE - The International Society of Optical Engineering
3 Conference Proceedings Hot embossing and injection molding for micro-optical components

Heckele,M., Bacher,W., Hanemann,T., Ulrich,H.

SPIE-The International Society for Optical Engineering
9 Conference Proceedings Thin-Wall Injection Molding Using Rapidly Heated Molds

Yao, D., Kim, B.H.

Society of Plastics Engineers
4 Conference Proceedings Two-Material Injection Molding Filling Simulation

Liu, W., Kim, B., Yao, D.

Society of Plastics Engineers
10 Conference Proceedings RAPID THERMAL ANNEALED TiW/Ti CONTACT METALLIZATION FOR ADVANCED VLSI Si CIRCUITS

Chung, Henry W., Yao, Agnes T.

Materials Research Society
5 Conference Proceedings Development of Rapid Heating and Uniformly Pressing System for Micro Hot Embossing

Chang, J.H., Yang, S.Y.

Society of Plastics Engineers
11 Conference Proceedings RAPID THERMAL ANNEALED TiW/Ti CONTACT METALLIZATION FOR ADVANCED VLSI Si CIRCUITS

Chung, Henry W., Yao, Agnes T.

Materials Research Society
6 Conference Proceedings Micro hot embossing for high-aspect-ratio structure with materials flow enhancement by polymer sheet

Murakoshi, Y., Shan, X.-C., Sano, T., Takahashi, M., Maeda, R.

SPIE - The International Society of Optical Engineering
12 Conference Proceedings Simulation of filling characteristics during hot embossing of polymer microstructures

P. Jin, Y. Gao, T. Liu

Society of Photo-optical Instrumentation Engineers
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12