Blank Cover Image

Processing Characteristics of PSU/PC Blend Associated with Degradation in Injection Molding

Author(s):
Lee, B.H. ( Entegris, Inc. )  
Publication title:
ANTEC 2004, 62nd annual technical conference, Chicago, IL, May 16-20, 2004
Title of ser.:
Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
Ser. no.:
62
Pub. Year:
2004
Page(from):
681
Page(to):
687
Pages:
7
Pub. info.:
Brookfield Center, Conn.: Society of Plastics Engineers
ISBN:
9780975370704 [0975370707]
Language:
English
Call no.:
S42700/62-1
Type:
Conference Proceedings

Similar Items:

Lee, B. H.

Society of Plastics Engineers, Inc. (SPE)

Efner F. H., Beever H. W., Lindstrom R. M., Lee D. M.

Society of Plastics Engineers, Inc. (SPE)

Choi, K.Ii, Koo, B.H.

Society of Plastics Engineers

Weckle, C. L., Lauer, D. P., Patty, B. S., Pham, H. T.

Society of Plastics Engineers, Inc. (SPE)

Yao, D., Kim, B.H.

Society of Plastics Engineers

Lee, J.S., Bae, J.S., Song, H.W., Jun, B.H., Gorman, J., Jiang, Z.-T., No, K.

Electrochemical Society

Lee, B.H., Kim, B.H.

Society of Plastics Engineers, Inc. (SPE)

Rhee, B. O., Ahn, H. -K., Lee, K. D., Yu, B. K., Son, C. -W.

Society of Plastics Engineers, Inc. (SPE)

Lee, B.H., Kim, B.H.

Society of Plastics Engineers, Inc. (SPE)

Dillman, S.H., Howe, D., Robar, H.

Society of Plastics Engineers, Inc. (SPE)

KIM, S. C., KIM, J. H.

American Institute of Chemical Engineers

12 Conference Proceedings Simulation of Thermoset Injection Molding

Chiu, H., Chen, S., Lee, L.

American Institute of Chemical Engineers

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12