Blank Cover Image

Analysis of the Three Dimensional Mold-Filling Process in Injection Molding

Author(s):
Publication title:
ANTEC 2004, 62nd annual technical conference, Chicago, IL, May 16-20, 2004
Title of ser.:
Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
Ser. no.:
62
Pub. Year:
2004
Page(from):
501
Page(to):
505
Pages:
5
Pub. info.:
Brookfield Center, Conn.: Society of Plastics Engineers
ISBN:
9780975370704 [0975370707]
Language:
English
Call no.:
S42700/62-1
Type:
Conference Proceedings

Similar Items:

Wang W. V., Hieber A. C., Wang K. K.

Society of Plastics Engineers, Inc. (SPE)

Souder V. B., Whitehall L. B., Davis E. J.

Society of Plastics Engineers, Inc. (SPE)

Najmi, L. A.

Society of Plastics Engineers, Inc. (SPE)

Rajupalem V., Talwar K., Friedl C.

Society of Plastics Engineers, Inc. (SPE)

Palit, K.

Society of Plastics Engineers, Inc. (SPE)

Chang, R. -Y., Yang, W. -H.

Society of Plastics Engineers

Yao, D., Kim, B.H.

Society of Plastics Engineers

Chang, R.Y., Hsu, D.C., Yang, V., Yang, W.H.

Society of Plastics Engineers

Lee, B.H.

Society of Plastics Engineers

Ilinca,F., Hetu,J-F., Derdouri,A., Stevenson,J.

Society of Plastic Engineers.

Gao, D. M.

Society of Plastics Engineers, Inc. (SPE)

Chung, S. T., Kang, T. G., Park, S. J., Kwon, Y. S., Ahn, H. K., Yoon, T.

Society of Plastics Engineers

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12