Novel Method for Wafer-Scale Packaging of Opto-electronic Devices

Novel Method for Wafer-Scale Packaging of Opto-electronic Devices

Author(s):

Spencer, Daryl ( University of Arkansas )
Malshe, Ajay P.
Foster, Ronald B.
O'Neal, Chad B. ( SYSCONN Corporation )

Publication title:

Proceedings, 2003 International Symposium on Microelectronics, November 18-20, 2003, Hynes Convention Center, Boston, Massa Massachusetts, USA

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5288

Pub. Year:

2003

Page(from):

708

Page(to):

713

Pages:

6

Pub. info.:

Reston, Va.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819451897 [0819451894]

Language:

English

Call no.:

P63600/5288

Type:

Conference Proceedings

Details

TDL ID:	ZA00013172
Series ID:	PA00000029
Conf. info. (Name):	International Symposium on Microelectronics
Conf. info. (Number):	2003
Conf. info. (Venue):	Boston, MA, USA
Conf. info. (Date):	2003.11.18-2003.11.20

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