The Investigation of Lead-Free Package Reliability

The Investigation of Lead-Free Package Reliability

Author(s):

Lee, Jeffrey C. B. ( Advanced Semiconductor Engineering )
Chiang, C, M.
Cruz, Alejandro R.
Li, Simon

Publication title:

Proceedings, 2003 International Symposium on Microelectronics, November 18-20, 2003, Hynes Convention Center, Boston, Massa Massachusetts, USA

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5288

Pub. Year:

2003

Page(from):

212

Page(to):

217

Pages:

6

Pub. info.:

Reston, Va.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819451897 [0819451894]

Language:

English

Call no.:

P63600/5288

Type:

Conference Proceedings

Details

TDL ID:	ZA00013172
Series ID:	PA00000029
Conf. info. (Name):	International Symposium on Microelectronics
Conf. info. (Number):	2003
Conf. info. (Venue):	Boston, MA, USA
Conf. info. (Date):	2003.11.18-2003.11.20

Similar Items:

1 Conference Proceedings Reliability of Lead Free BGA Packages Prasad,Swaminath, Carson,Flynn, Kim,G.S., Lee,J.S., Jeong,T.S., Kim,Y.S. IMAPS	7 Conference Proceedings Session D : Semiconductor Manufacturing Technology Reliability Prediction for 95.5Sn3.9AgO.6Cu Solder Bump and Thermal Design for Lead Free System in Package … Hsu, H.C., Hung, W.M. Trans Tech Publications
2 Conference Proceedings Thermodynamic Issues of Lead-Free Soldering in Electronic Packaging Jeong, S.W., Kim, J.H., Lee, H.M. Trans Tech Publications	8 Conference Proceedings High Energy Impact Resistance of Sb-Sn Lead-Free SMT Joint Wu, C.M.L., Yeung, N.H., Lam, W.H., Li, R.K.Y. Trans Tech Publications
3 Conference Proceedings Ferroelastic Domains and Anisotropy in Lead Free Piezoelectrics B.Z. Li, C. Fancher, J.E. Blendell, R.E. Garcia, K.J. Bowman Trans Tech Publications	9 Conference Proceedings (105e) Lead-Free Nanosolders for Nanowires Assembly and Packaging Fan Gao, Xiaopeng Li, Yang Shu, Zhiyong Gu American Institute of Chemical Engineers
4 Conference Proceedings SnZnAl Lead-Free Solder with High Packaging Reliability Kitajima, Masayuki, Shono, Tadaaki, Masuda, Satoshi SPIE-The International Society for Optical Engineering	10 Conference Proceedings Flip-Chip Metallurgies for Lead-Free Solders Korhonen, T. M., Hong, S. J., Korhonen, M. A., Li, C.-Y. MRS - Materials Research Society
5 Conference Proceedings Validation and reliability assessment of board level drop test of chip-scale-packaging T.-Y. Hung, C. Y. Chou, M.-C. Yew, K.-N. Chiang Society of Photo-optical Instrumentation Engineers	11 Conference Proceedings Packaging considerations for reliability of electrically controlled MEMS VOA Lee, Y.G., Hong, S.K., Park, M.Y., Jung, S.C., Lee, S.H. SPIE - The International Society of Optical Engineering
6 Conference Proceedings Thermo-Mechanical Reliability and Performance Degradation of a Lead-Free RF Power Amplifier with Gan-on-SiC Hemts J. Lang, I. Belov, J. Hellen, J.K. Lim, B. Schodt, T. Nilsson, R. Poder, M. Bakowski, P. Leisner Trans Tech Publications	12 Conference Proceedings Lead Free Solders for Area Array Packaging Jung,E., Kloeser,J., Aschenbrenner,R., Reichl,H., Kallmayer,Ch., Coskina,P. IMAPS

1

2

3

4

5

6

7

8

9

10

11

12