SIDE-FILL UNDERFILL FOR RF SAW PACKAGING

SIDE-FILL UNDERFILL FOR RF SAW PACKAGING

Author(s):

Chang, Michael ( Tong Hsing Electronic Industries, Ltd. )
Lu, Brian
Wu, Ken
Fukui, Tarou ( Matsushita Electric Works, Ltd. )

Publication title:

Proceedings : 2003 IMAPS Conference and Exhibition on Ceramic Interconnect Technology : The Next Generation : April 7-9, 2003, The Westin Hotel, Denver, Colorado

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5231

Pub. Year:

2003

Page(from):

35

Page(to):

38

Pages:

4

Pub. info.:

Washington, DC: IMAPS

ISSN:

0277786X

ISBN:

9780819451057 [0819451053]

Language:

English

Call no.:

P63600/5231

Type:

Conference Proceedings

Details

TDL ID:	ZA00013164
Series ID:	PA00000029
Conf. info. (Name):	IMAPS Conference and Exhibition on Ceramic Interconnect Technology
Conf. info. (Number):	2003
Conf. info. (Venue):	Denver, Colorado, USA
Conf. info. (Date):	2003.04.07-2003.04.09

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