Beginning-to-end wafer bonding for advanced optical systems (Invited Paper)
- Author(s):
- Farrens, S.N. ( EV Group Inc. (USA) )
- Lindner, P. ( EV Group Inc. (Austria) )
- Dwyer, S. ( EV Group Inc. (USA) )
- Wimplinger, M. ( EV Group Inc. (USA) )
- Publication title:
- Gradient index, miniature, and diffractive optical systems III : 6-7 August 2003, San Diego, California, USA
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 5177
- Pub. Year:
- 2003
- Page(from):
- 31
- Page(to):
- 36
- Pages:
- 6
- Pub. info.:
- Bellingham, Wash., USA: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819450500 [0819450502]
- Language:
- English
- Call no.:
- P63600/5177
- Type:
- Conference Proceedings
Similar Items:
Materials Research Society |
SPIE - The International Society of Optical Engineering |
Electrochemical Society |
SPIE-The International Society for Optical Engineering |
3
Conference Proceedings
Atmospheric Plasma Conditions Compatible with Wafer to Wafer Bonding Strategies
Electrochemical Society |
Electrochemical Society |
SPIE - The International Society of Optical Engineering |
10
Conference Proceedings
Effects of Bonding Process Parameters on Wafer-to-Wafer Alignment Accuracy in Benzocyclobutene (BCB) Dielectric Wafer Bonding.
Materials Research Society |
Electrochemical Society |
11
Conference Proceedings
Application of imprint technologies for creation of micro- and nanoscale pattern
SPIE - The International Society of Optical Engineering |
6
Conference Proceedings
Wafer Bonding of GaAs, InP, and Si Annealed without Hydrogen for Advanced Device Technologies
Electrochemical Society |
Electrochemical Society |