High-speed on-chip and chip-to-chip optical interconnection

High-speed on-chip and chip-to-chip optical interconnection

Author(s):

Tsuda, H. ( Keio Univ. (Japan) )
Nakahara, T. ( NTT Photonics Labs. (Japan) )

Publication title:

Fundamental problems of optoelectronics and microelectronics : 30 September-4 october, 2002, Vladivostok, Russia

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5129

Pub. Year:

2003

Page(from):

18

Page(to):

23

Pages:

6

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819449894 [081944989X]

Language:

English

Call no.:

P63600/5129

Type:

Conference Proceedings

Details

TDL ID:	ZA00013117
Series ID:	PA00000029
Conf. info. (Name):	Fundamental problems of optoelectronics and microelectronics
Conf. info. (Number):	2002
Conf. info. (Venue):	Vladivostok, Russia
Conf. info. (Date):	2002.09.30-2002.10.04

Similar Items:

1 Conference Proceedings High-speed optical packet processing technologies based on novel optoelectronic devices (Invited Paper) Takenouchi, H., Takahashi, R., Takahata, K., Nakahara, T., Suzuki, H. SPIE - The International Society of Optical Engineering	7 Conference Proceedings 1.3-ｦﾌm lnP-based n-type modulation-doped strained multiquantum well lasers for high-density parallel optical interconnections (Invited Paper) Nakahara,K., Tsuchiya,T., Niwa,A., Uomi,K., Haga,T., Taniwatari,T., Toyonaka,T. SPIE-The International Society for Optical Engineering
2 Conference Proceedings Heteroepitaxy on high-quality GaAs on Si for optical interconnection on Si chip M. Tamura, J. Palmer, T. Yodo, T. Saitoh Society of Photo-optical Instrumentation Engineers	8 Conference Proceedings Optical information processing using arrayed-waveguide gratings and its application to optical communication systems Tsuda,H., Kurokawa,T. SPIE-The International Society for Optical Engineering
3 Conference Proceedings High-density parallel optical interconnection for IoTbps interconnection in high-speed memory test systems (Invited Paper) [6124-21] Okayasu, T., Hayase, Y., Ono,A., Watanabe,D., Mori,H., Nomura, T. SPIE - The International Society of Optical Engineering	9 Conference Proceedings 10Gb/s VCSEL transmitter for chip-to-chip optical interconnection [6353-115] Anh Vu, N., Lee, T.-W., Park, H.-H. SPIE - The International Society of Optical Engineering
4 Conference Proceedings Optical interconnection on silicon LSI chips S. Yokoyama, T. Nagata, T. Namba, Y. Kuroda, T. Doi Society of Photo-optical Instrumentation Engineers	10 Conference Proceedings Characteristic study of chip-on-film interconnection Chang,S.-M., Jou,J.-H., Hsieh,A., Chen,T.-H., Chang,C.-Y., Wang,Y.-H., Lin,H.-Y., Huang,C.-M. SPIE - The International Society for Optical Engineering
5 Conference Proceedings High-speed GaInNAs laser diodes Kondow, M., Nakahara, K., Fujisaki, S., Tanaka, S., Kudo, M., Taniguchi, T., Terano, A., Uchiyama, H. SPIE - The International Society of Optical Engineering	11 Conference Proceedings Vertical-cavity modulator for optical interconnection and its high-speed performance Liu,H., Lin,C.-C., Harris,J.S.,Jr. SPIE - The International Society for Optical Engineering
6 Conference Proceedings Smart pixels and their applications to optical interconnects Tsuda,H., Kurokawa,T. SPIE-The International Society for Optical Engineering	12 Conference Proceedings Optoelectronic packaging technologies for chip-level optical interconnections Takahara, H. SPIE-The International Society for Optical Engineering

1

2

3

4

5

6

7

8

9

10

11

12