Adhesive wafer bonding for MEMS applications

Adhesive wafer bonding for MEMS applications

Author(s):

Dragoi, V. ( EV Group E. Thallner GmbH (Austria) )
Glinsner, T. ( EV Group E. Thallner GmbH (Austria) )
Mittendorfer, G. ( EV Group E. Thallner GmbH (Austria) )
Wieder, B. ( EV Group E. Thallner GmbH (Austria) )
Lindner, P. ( EV Group E. Thallner GmbH (Austria) )

Publication title:

Smart Sensors, Actuators, and MEMS

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5116

Pub. Year:

2003

Vol.:

1

Pt.:

Session 3

Page(from):

160

Page(to):

167

Pages:

8

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819449764 [0819449768]

Language:

English

Call no.:

P63600/5116

Type:

Conference Proceedings

Details

TDL ID:	ZA00013104
Series ID:	PA00000029
Conf. info. (Name):	Microtechnologies for the New Millennium : Smart Sensors, Actuators, and MEMS
Conf. info. (Number):	2003
Conf. info. (Venue):	Maspalomas, Gran Canaria, Spain
Conf. info. (Date):	2003.05.19-2003.05.21
Note for article:	Session 3. MEMS I ; 5116-18

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