Location of interconnect defects using focused ion beam (FIB) induced voltage contrast and subsequent auger electron analysis of in-situ FIB cross sections in the physical electronics 200/300-mm SMART-tool

Location of interconnect defects using focused ion beam (FIB) induced voltage contrast and subsequent auger electron analysis of in-situ FIB cross sections in the physical electronics 200/300-mm SMART-tool

Author(s):

Gondran, C.F.H. ( International SEMATECH (USA) )
Paul, D.F. ( Physical Electronics, Inc. (USA) )
Childs, K.D. ( Physical Electronics, Inc. (USA) )
Dennig, L.G. ( International SEMATECH (USA) )
Smith, G.C. ( International SEMATECH (USA) )

Publication title:

Process and Materials Characterization and Diagnostics in IC Manufacturing

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5041

Pub. Year:

2003

Page(from):

142

Page(to):

148

Pages:

7

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819448460 [081944846X]

Language:

English

Call no.:

P63600/5041

Type:

Conference Proceedings

Details

TDL ID:	ZA00013032
Series ID:	PA00000029
Conf. info. (Name):	Microelectronic Manufacturing : Process and Materials Characterization and Diagnostics in IC Manufacturing
Conf. info. (Number):	2003
Conf. info. (Venue):	Santa Clara, CA, USA
Conf. info. (Date):	2003.02.27-2003.02.28

Similar Items:

1 Conference Proceedings Submicron particle identification by compositional defect review using Auger analysis Childs, K.D., Paul, D.F., Morohashi, T., Clough, S.P. SPIE-The International Society for Optical Engineering	7 Conference Proceedings Smart electronics and microengineering: the Australian focus (Invited Paper) Hariz,A. SPIE-The International Society for Optical Engineering
2 Conference Proceedings Sub-0.25-ｦﾌm defect analysis on 200-mm semiconductor wafers Childs,K.D., Paul,D.F., Clough,S.P. SPIE-The International Society for Optical Engineering	8 Technical Paper Section 4 Electronics Ziomek,Joseph F., Cops,Michael, Groszek,Len J., Phail,Fred H., Turner,David, Sconyers,Woodlea B., Applewhite,Marvin, … Society of Automotive Engineers
3 Conference Proceedings Novel technique for contamination analysis around the edge, the bevel, and the edge exclusion area of 200 and 300mm silicon wafers Sparks, C.M., Gondran, C.F.H., Lysaght, P.S., Donahue, J.T. SPIE-The International Society for Optical Engineering	9 Conference Proceedings On Detection of Damage Location of Bridges Liang,Z., Lee,G.C., Kong,F. Society for Experimental Mechanics
4 Conference Proceedings 32｡ﾟ16 CMOS smart pixel array for optical interconnects Kim,J., Guilfoyle,P.S., Stone,R.V., Hessenbruch,J.M., Choquette,K.D., Kiamilev,F.E. SPIE - The International Society for Optical Engineering	10 Conference Proceedings Focused-Ion-Beam Milling and Micromanipulation Lift-Out for Site-Specific-Cross-Section TEM Specimen Preparation Giannuzzi, L. A., Drown, J. L., Brown, S. R., Irwin, R. B., Stevie, F. A. MRS - Materials Research Society
5 Conference Proceedings Performance analysis of a thermionic thermal detector at 400 K,300 K,and 200 K Murguia,J.E., Tedrow,P.K., Shepherd,F.D., Leahy,D., Weeks,M.M. SPIE - The International Society for Optical Engineering	11 Conference Proceedings Rectenna performance under a 200-W amplifier microwave Song, K.D., Choi, S.H., Golembiewski, W.T., Henderson, K., King, G.C. SPIE - The International Society of Optical Engineering
6 Conference Proceedings FIB voltage-contrast localization and analysis of contact via chains Jacob,P.J., Doering,E. SPIE - The International Society for Optical Engineering	12 Conference Proceedings Rectenna performances for smart membrane actuators Choi, S.H., Song, K.D., King, G.C., Woodall, C. SPIE-The International Society for Optical Engineering

1

2

3

4

5

6

7

8

9

10

11

12