Rigorous simulation of exposure over nonplanar wafers

Rigorous simulation of exposure over nonplanar wafers

Author(s):

Erdmann, A. ( Fraunhofer Institute of Integrated Systems and Device Technology (Germany) )

Kalus, C.K. ( SIGMA-C GmbH (Germany) )

Schmoeller, T. ( SIGMA-C GmbH (Germany) )

Klyonova, Y. ( SIGMA-C GmbH (Germany) )

Sato, T. ( Toshiba Corp. (Japan) )

Endo, A. ( Toshiba Corp. (Japan) )

Shibata, T. ( Toshiba Corp (Japan) )

Kobayashi, Y. ( Toshiba Corp. (Japan) )

3 more

Publication title:

Optical Microlithography XVI

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5040

Pub. Year:

2003

Vol.:

Part One

Page(from):

101

Page(to):

111

Pages:

11

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819448453 [0819448451]

Language:

English

Call no.:

P63600/5040

Type:

Conference Proceedings

Details

TDL ID:	ZA00013029
Series ID:	PA00000029
Conf. info. (Name):	SPIE Advanced Lithography : Optical microlithography
Conf. info. (Number):	2003 : 16th
Conf. info. (Venue):	Santa Clara, CA, USA
Conf. info. (Date):	2003.02.25-2003.02.28

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