Highly etch-selective spin-on bottom antireflective coating for use in 193-nm lithography and beyond

Highly etch-selective spin-on bottom antireflective coating for use in 193-nm lithography and beyond

Author(s):

Pfeiffer, D. ( IBM Thomas J. Watson Research Ctr. (USA) )

Mahorowala, A.P. ( IBM Thomas J. Watson Research Ctr. (USA) )

Babich, K. ( IBM Thomas J. Watson Research Ctr. (USA) )

Medeiros, D.R. ( IBM Thomas J. Watson Research Ctr. (USA) )

Petrillo, K.E. ( IBM Thomas J. Watson Research Ctr. (USA) )

Angelopoulos, M. ( IBM Thomas J. Watson Research Ctr. (USA) )

Huang, W.-S. ( IBM Microelectronics Div. (USA) )

Halle, S. ( IBM Microelectronics Div. (USA) )

Brodsky, C. ( IBM Microelectronics Div. (USA) )

Allen, S.D. ( IBM Microelectronics Div. (USA) )

Holmes, S.J. ( IBM Microelectronics Div. (USA) )

Kwong, R.W. ( IBM Microelectronics Div. (USA) )

Lang, R. ( IBM Microelectronics Div. (USA) )

Brock, P.J. ( IBM Almaden Research Ctr. (USA) )

9 more

Publication title:

Advances in Resist Technology and Processing XX

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

5039

Pub. Year:

2003

Vol.:

1

Pt.:

Session 4

Page(from):

136

Page(to):

143

Pages:

8

Pub. info.:

Bellingham, CA: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819448446 [0819448443]

Language:

English

Call no.:

P63600/5039

Type:

Conference Proceedings

Details

TDL ID:	ZA00013027
Series ID:	PA00000029
Conf. info. (Name):	SPIE Advanced Lithography : Advances in Resist Technology and Processing
Conf. info. (Number):	2003 : 20th
Conf. info. (Venue):	Santa Clara, CA
Conf. info. (Date):	2003.02.24-2003.02.26
Note for article:	Session 4. Antireflective Coatings ; 5039-15

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