Flip-chip bonded optoelectronic integration based on ultrathin silicon (UTSi) CMOS
- Author(s):
- Hong, S. ( Univ. of Southern California (USA) )
- Ho, T. ( Univ. of Southern California (USA) )
- Zhang, L. ( Univ. of Southern California (USA) )
- Sawchuk, A.A. ( Univ. of Southern California (USA) )
- Publication title:
- Photonics Packaging and Integration III
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 4997
- Pub. Year:
- 2003
- Page(from):
- 127
- Page(to):
- 134
- Pages:
- 8
- Pub. info.:
- Bellingham, Wash.: SPIE-The International Society for Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819447975 [0819447978]
- Language:
- English
- Call no.:
- P63600/4997
- Type:
- Conference Proceedings
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