New architecture of optical interconnection using 45-deg.-ended connection rods in waveguide-embedded printed circuit boards

New architecture of optical interconnection using 45-deg.-ended connection rods in waveguide-embedded printed circuit boards

Author(s):

Rho, B.S. ( Information and Communications Univ. (South Korea) )

Cho, H.S. ( Information and Communications Univ. (South Korea) )

Eo, J.-Y. ( Information and Communications Univ. (South Korea) )

Kang, S. ( Information and Communications Univ. (South Korea) )

Park, H.-H. ( Information and Communications Univ. (South Korea) )

Kim, Y.W. ( Samsung Electro-Mechanics Co., Ltd. (South Korea) )

Joe, Y.S. ( Samsung Electro-Mechanics Co., Ltd. (South Korea) )

Yang, D.J. ( Samsung Electro-Mechanics Co., Ltd. (South Korea) )

3 more

Publication title:

Photonics Packaging and Integration III

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4997

Pub. Year:

2003

Page(from):

71

Page(to):

78

Pages:

8

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819447975 [0819447978]

Language:

English

Call no.:

P63600/4997

Type:

Conference Proceedings

Details

TDL ID:	ZA00012980
Series ID:	PA00000029
Conf. info. (Name):	Photonics West - Optoelectronic Materials and Devices : Photonics packaging and integration
Conf. info. (Number):	2003 : 3rd
Conf. info. (Venue):	San Jose, CA, USA
Conf. info. (Date):	2003.01.28-2003.01.30

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