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Modification of sidewall roughness in silica deep etching and its influence on coupling loss in hybrid integration

Author(s):
  • Choi, D.Y. ( Samsung Electronics Co., Ltd. (South Korea) )
  • Lee, J.H. ( Samsung Electronics Co., Ltd. (South Korea) )
  • Kim, D.S. ( Samsung Electronics Co., Ltd. (South Korea) )
  • Jung, S.T. ( Samsung Electronics Co., Ltd. (South Korea) )
Publication title:
Integrated Optical Devices: Fabrication and Testing
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4944
Pub. Year:
2003
Page(from):
337
Page(to):
345
Pages:
9
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819447395 [0819447390]
Language:
English
Call no.:
P63600/4944
Type:
Conference Proceedings

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