Blank Cover Image

High-density optical interconnects within large-scale systems(Invited Paper)

Author(s):
Berger, C. ( IBM Zurich Research Lab. (Switzerland) )
Kossel, M.A. ( IBM Zurich Research Lab. (Switzerland) )
Menolfi, C. ( IBM Zurich Research Lab. (Switzerland) )
Morf, T. ( IBM Zurich Research Lab. (Switzerland) )
Toifl, T. ( IBM Zurich Research Lab. (Switzerland) )
Schmatz, M.L. ( IBM Zurich Research Lab. (Switzerland) )
1 more
Publication title:
VCSELs and Optical Interconnects
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4942
Pub. Year:
2003
Page(from):
222
Page(to):
235
Pages:
14
Pub. info.:
Bellingham, Wash.: SPIE-The International Society for Optical Engineering
ISSN:
0277786X
ISBN:
9780819447371 [0819447374]
Language:
English
Call no.:
P63600/4942
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Challenges for the introduction of board-level optical interconnect technology into product development roadmaps (Invited Paper) [6124-18]

Berger, C., Offrein, B. J., Schmatz,M.

SPIE - The International Society of Optical Engineering
7 Conference Proceedings High-density, end-to-end optoelectronic integration and packaging for digital-optical interconnect systems (Invited Paper)

Chang, G. -K., Guidotti, D., Huang, Z. R., Wan, L., Yu, J., Hegde, S., Kuo, H. -F., Chang, Y, -J., Liu, F., Wang, F., …

SPIE - The International Society of Optical Engineering
2 Conference Proceedings High-density hybrid interconnect technologies (Invited Paper)

John, J., Zimmermann, L., De Moor, P., De Munck, K., Borgers, T., Van Hoof, C.

SPIE - The International Society of Optical Engineering
8 Conference Proceedings Integration of optical I/O with organic chip packages

B. J. Offrein, C. Berger, L. Dellmann, P. Dill, F. Horst, M. Schmatz

Society of Photo-optical Instrumentation Engineers
3 Conference Proceedings Progress toward board-level optical interconnect technology (Invited Paper)

Moynihan, M.L., Sicard, B., Ho, T., Little, L., Pugliano, N., Shelnut, J.G., Zheng, H.B., Knudsen, P., Lundy, D., …

SPIE - The International Society of Optical Engineering
9 Conference Proceedings Germanium waveguide for optical interconnects in very large scale integrated optics

Dubey,M., Lareau,R.T., Cole,M.W., Jones,K.A., West,L.C., Roberts,C.W., Piscani,E.C.

SPIE-The International Society for Optical Engineering
4 Conference Proceedings Low-cost electro-optical package for use with PCB-embedded waveguides

J. Weiss, C. Berger, M. Witzig, T. Morf, R. Dangel

Society of Photo-optical Instrumentation Engineers
10 Conference Proceedings A scaleable optical interconnect for low-latency cell switching in high-performance computing systems (Invited Paper) [6124-22]

Sauer, M., Hemenway, R., Grzybowski. R, Peters D, Dickens J, Karfelt R

SPIE - The International Society of Optical Engineering
5 Conference Proceedings Nano-spring arrays for high-density interconnect

Fork,D.K., Chua,C.L., Kim,P., Romano,L.T., Lau,R., Wong,L., Alimonda,A., Geluz,V., Teepe,M., Haemer,J., Modi,M., Zhu,Q., …

SPIE-The International Society for Optical Engineering
11 Conference Proceedings Board level guided-wave optical interconnects (Invited Paper)

Choi, C., Liu, Y., Lin, L., Chen, R.T.

SPIE-The International Society for Optical Engineering
6 Conference Proceedings High-density optical interconnect using polymer waveguides interfaced to a VCSEL array in molded plastic packaging (Invited Paper)

Liu,Y.S., Wojnarowski,R.J., Hennessy,W.A., Piacente,P.A., Rowlette,Sr.,J.R., Kadar-Kallen,M.A., Stack,J.D., Liu,Y., …

SPIE-The International Society for Optical Engineering
12 Conference Proceedings Analysis of crosstalk between radial-tilt error and tracking error in tracking servo of high-density digital versatile disk (Invited Paper)

Wang, Y.X., Gong, M.L., Yan, P., Jia, W,P., Cui, R.Z., Zhang, H.T., Huang, L., Wei, N.

SPIE-The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12