Blank Cover Image

The Effect of Surface Tension and Contact Angle on the Filling Behavior of Flip-Chip Underfill

Author(s):
Publication title:
ANTEC 2003, annual technical conference, May 4-8, Nashville, Tennessee
Title of ser.:
Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
Ser. no.:
61
Pub. Year:
2003
Page(from):
1680
Page(to):
1684
Pages:
5
Pub. info.:
Brookfield Center, Conn.: Society of Plastics Engineers
ISBN:
9780972718011 [097271801X]
Language:
English
Call no.:
S42700/61-2
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Experimental Study for Underfill of Flip Chip Packages

Jong, W-R., Chen, S., Lai, C., Tsai, H., Liu, H., Ho, S., Lo, W-Y.

Society of Plastics Engineers
7 Conference Proceedings Effect of Al Pad Surface Morphology on the Flip-Chip Solder Bump Reliability

Yau, Esther, W.C., Law, Simon P.C., Wei, J.Z., Chan, Phillip C.H.

IMAPS
2 Conference Proceedings Molding Analysis for Underfill of Flip-Chip Packages

Jong, W.R., Chen, S.C., Lai, C.C., Kuo, T.H., Liu, H.W., Ho, S., Lo, W.Y.

Society of Plastics Engineers
8 Technical Paper Effect of underfill in flip chip on board assemblies

Okura, Juscelino H., Darbha, Krishna, Dasgupta, Abhijit

The American Society of Mechanical Engineers
3 Conference Proceedings Three-Dimensional Cae Analysis Of Underfill Flow Of Flip-Chips (374)

Chang,R-Y., Hung,C-C., Yang,W-H.

Society of Plastic Engineers.
9 Conference Proceedings Underfill Injection Molding in Flip-Chip Packaging with Different Bumps Array Arrangements

C.M. Lin, C.Y. Chu, W.L. Chang

Trans Tech Publications
4 Conference Proceedings WAFER APPLIED UNDERFILLS FOR FLIP CHIP ASSEMBLY

Johnson, R. Wayne, Wang, Qing, Ding, Fei, Zhao, Renzha, Crane, Larry, Konarski, Mark, Yaeger, Erin, Torres, Afranio, …

IMAPS
10 Conference Proceedings Passive alignment flip chip assembly using surface tension of liquid solder and micromechanical stops (Invited Paper)

Oppermann, H.H., Hutter, M., Engelmann, G., Reichl, H.

SPIE - The International Society of Optical Engineering
5 Conference Proceedings Cure Kinetics of Advanced Flip-Chip Underfill Materials

Hsu, D.I., Kim, H.K., Shi, F.G., Chungpaiboonpatana, S., Davidson, C., Adams, J.M.

Electrochemical Society
11 Technical Paper Effect of underfill on deformations of surface laminar circuit in flip chip package

Kunthong, P., Han, B.

The American Society of Mechanical Engineers
6 Conference Proceedings Flow Properties of Underfill Materials in Flip-Chip Packaging

Wang,Jinlin

IMAPS
12 Conference Proceedings "Bump & Underfill Free Flip-Chip Technology for VLSI/MCM Assembly, Based on Universal Contact Unit"

Taran,Alexander, Krivoshapko,Vladimir, Reilly,Patrick

IMAPS
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12