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Experimental Study for Underfill of Flip Chip Packages

Author(s):
Jong, W-R. ( Chung Yuan Christian University )
Chen, S.
Lai, C.
Tsai, H.
Liu, H.
Ho, S. ( Ta Hwa Institute of Technology )
Lo, W-Y.
2 more
Publication title:
ANTEC 2003, annual technical conference, May 4-8, Nashville, Tennessee
Title of ser.:
Annual Technical Conference - ANTEC : Society of Plastics Engineers Annual Technical Papers
Ser. no.:
61
Pub. Year:
2003
Page(from):
1335
Page(to):
1341
Pages:
7
Pub. info.:
Brookfield Center, Conn.: Society of Plastics Engineers
ISBN:
9780972718011 [097271801X]
Language:
English
Call no.:
S42700/61-2
Type:
Conference Proceedings

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