Reliability of the 1st Level and the 2nd Level Inteconnections on the Flip Chip PBGA Package

Reliability of the 1st Level and the 2nd Level Inteconnections on the Flip Chip PBGA Package

Author(s):

Ahn, Eun-Chul ( Samsung Electronics Co., Ltd. )
Lee, Young-Min
Ryu, Ju-Hyun
Chung, Tae-Gyeong
Oh, Se-Yong

Publication title:

Proceedings : 2002 International Symposium on Microelectronics : September 4-6, 2002, Colorado Convention Center, Denver, CO

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4931

Pub. Year:

2002

Page(from):

839

Page(to):

844

Pages:

6

Pub. info.:

Washington, DC: IMAPS

ISSN:

0277786X

ISBN:

9780930815660 [0930815661]

Language:

English

Call no.:

P63600/4931

Type:

Conference Proceedings

Details

TDL ID:	ZA00012780
Series ID:	PA00000029
Conf. info. (Name):	International Symposium on Microelectronics
Conf. info. (Number):	2002
Conf. info. (Venue):	Denver, CO, USA
Conf. info. (Date):	2002.09.04-2002.09.06

Similar Items:

1 Conference Proceedings Reliability Challenges of Flip Chip on Organic Substrate Cho, Tae-je, Ahn, Eun-Chul, Shim, Jong-Bo, Moon, Ho-Joong, Oh, Se-Yong IMAPS	7 Conference Proceedings Time-Resolved Photoluminescence Measurements of In0.15Ga0.85N/In0.015Ga0.985N Quantum Wells with Si-doped Barriers Ryu, Mee-Yi, Yu, Young Jun, Yu, Phil Won, Shin, Eun-joo, Oh, Eunsoon, Sone, Chul Soo, Nam, Ok Hyun, Park, Yong Jo Materials Research Society
2 Conference Proceedings ZrO₂-supported Pt Catalysts for Water Gas Shift Reaction and Their Non-Pyrophoric Property Hyun Chul Lee, Doohwan Lee, Ok Young Lim, Soonho Kim, Yong Tae Kim, Eun- Yong Ko, Eun Duck Park Elsevier	8 Conference Proceedings Attrition and CO₂ adsorption of dry sorbents in fluidized bed Ki Chul Cho, Eun Yong Lee, Jeong Suk Yoo, Young Hean Choung, Sang Woo Park, Kwang Joong Oh Elsevier
3 Conference Proceedings Fabrication and Evaluation of 3-D Packages With Through Hole Via Dong Min Jang, Kwang Yong Lee, Chung Hyun Ryu, Byeong Hoon Cho, Tae Sung Oh, Joung Ho Kim, Won Jong Lee, Jin Yu Materials Research Society	9 Conference Proceedings (490d) Fractionation and Bioconversion of Micro-Algae Into Bioethanol Jung Kon Kim, Tae Hyun Kim, Eun Ju Lee, Dong Uk Ahn American Institute of Chemical Engineers
4 Conference Proceedings Corrosion Studies of mBGA Package Chung,Tae-Gyeong, Ahn,Sang-Ho, Kim,Shin, Oh,Seyong IMAPS	10 Conference Proceedings Width and Gap Dependent Performance of Ferroelectric Coplanar Waveguide Phase Shifter Based on (Ba,Sr)TiO3 Thin Films Moon, Seung Eon, Kim, Eun-Kyoung, Kwak, Min Hwan, Kim, Young-Tae, Ryu, Han-Cheol, Lee, Su-Jae, Kang, Kwang-Yong, Kim, … Materials Research Society
5 Technical Paper Heel Cracking of gold wires in plastic packages Ahn, Seung-Ho, Kim, Kyung-Sup, Ahn, Min-Chul, Oh, Se-Yong The American Society of Mechanical Engineers	11 Conference Proceedings MIM Capacitor Using ALD Al2O3 for RF IC and DRAM applications Ko, Sung Yong, Oh, Jung Ik, Choi, Joung Cheul, Lee, Kang Hee, Bae, Young Ho, Jung, Young Chul, Lee, Yong Hyun Materials Research Society
6 Conference Proceedings MICROWAVE FREQUENCY MODEL OF FLIP-CHIP INTERCON-NECTS USING ANISOTROPIC CONDUCTIVE FILM Ryu,Woonghwan, Yim,Myung-Jin, Lee,Junho, Jeon,Young-Doo, Ahn,Seungyoung, Paik,Kyung-Wook, Kim,Joungho, Yun,Young-hwan, … IMAPS	12 Conference Proceedings Fine Pitch 2nd Bond Evaluation for PBGA Packages : Process Capability and Reliability Assessments Tran, Tu Anh, Carpenter, Burt, Yong, Lois, Ridsdale, Greg, Ravenscraft, Dennis, Harun, Fuaida, George, Edwin IMAPS

1

2

3

4

5

6

7

8

9

10

11

12