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Design and Reliability Study for Flip Chip Applications on Ultra-Thin Flexible Substrates using NanoPierce Connection System Technology

Author(s):
Zou, B. ( NanoPierce Technologies, Inc. )
Kober, M.
Blum, F.
Mieslinger, S.
Gaherty, L.
Steinberg, W.
Bahn, B.
Wernle, M.
Neahaus, H.
4 more
Publication title:
Proceedings : 2002 International Symposium on Microelectronics : September 4-6, 2002, Colorado Convention Center, Denver, CO
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
4931
Pub. Year:
2002
Page(from):
818
Page(to):
824
Pages:
7
Pub. info.:
Washington, DC: IMAPS
ISSN:
0277786X
ISBN:
9780930815660 [0930815661]
Language:
English
Call no.:
P63600/4931
Type:
Conference Proceedings

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