Challenge of Flip Chip Encapsulation Technologies
- Author(s):
- Chai, Kevin ( Siliconware Precision Industries Co., Ltd. )
- Wu, Eddy
- Hsieh, Roger
- Tong, J.Y.
- Publication title:
- Proceedings : 2002 International Symposium on Microelectronics : September 4-6, 2002, Colorado Convention Center, Denver, CO
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 4931
- Pub. Year:
- 2002
- Page(from):
- 733
- Page(to):
- 737
- Pages:
- 5
- Pub. info.:
- Washington, DC: IMAPS
- ISSN:
- 0277786X
- ISBN:
- 9780930815660 [0930815661]
- Language:
- English
- Call no.:
- P63600/4931
- Type:
- Conference Proceedings
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