Effect of Al Pad Surface Morphology on the Flip-Chip Solder Bump Reliability

Effect of Al Pad Surface Morphology on the Flip-Chip Solder Bump Reliability

Author(s):

Yau, Esther, W.C. ( Hong Kong University of Science and Technology )
Law, Simon P.C.
Wei, J.Z.
Chan, Phillip C.H.

Publication title:

Proceedings : 2002 International Symposium on Microelectronics : September 4-6, 2002, Colorado Convention Center, Denver, CO

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4931

Pub. Year:

2002

Page(from):

656

Page(to):

661

Pages:

6

Pub. info.:

Washington, DC: IMAPS

ISSN:

0277786X

ISBN:

9780930815660 [0930815661]

Language:

English

Call no.:

P63600/4931

Type:

Conference Proceedings

Details

TDL ID:	ZA00012780
Series ID:	PA00000029
Conf. info. (Name):	International Symposium on Microelectronics
Conf. info. (Number):	2002
Conf. info. (Venue):	Denver, CO, USA
Conf. info. (Date):	2002.09.04-2002.09.06

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