Laser-induced shock wave removal of chemical-mechanical polishing slurries from silicon wafers

Laser-induced shock wave removal of chemical-mechanical polishing slurries from silicon wafers

Author(s):

Lee, J.M. ( IMT Co. Ltd. (South Korea) )

Cho, S.H.

Park, J.G. ( Hanyang Univ. (South Korea) )

Lee, S.H.

Han, Y.P. ( Samsung Electronics Co. Ltd. (South Korea) )

Kim, S.Y.

1 more

Publication title:

Third International Symposium on Laser Precision Microfabrication : proceedings : 27-31 May, 2002, Osaka, Japan

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4830

Pub. Year:

2003

Page(from):

287

Page(to):

289

Pages:

3

Pub. info.:

Bellingham, Wash., USA: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819446015 [0819446017]

Language:

English

Call no.:

P63600/4830

Type:

Conference Proceedings

Details

TDL ID:	ZA00012667
Series ID:	PA00000029
Conf. info. (Name):	International Symposium on Laser Precision Microfabrication
Conf. info. (Number):	2002 : 3rd
Conf. info. (Venue):	Osaka, Japan
Conf. info. (Date):	2002.05.27-2002.05.31

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