Femtosecond laser drilling of high-aspect-ratio 1-micron holes in silicon

Femtosecond laser drilling of high-aspect-ratio 1-micron holes in silicon

Author(s):

Alexander, D.R. ( Univ. of Nebraska/Lincoln (USA) )
Mihulka, B.
Doerr, D.W.

Publication title:

High-Power Laser Ablation IV

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

4760

Pub. Year:

2002

Vol.:

Part One

Page(from):

383

Page(to):

393

Pages:

11

Pub. info.:

Bellingham, Wash.: SPIE-The International Society for Optical Engineering

ISSN:

0277786X

ISBN:

9780819445247 [081944524X]

Language:

English

Call no.:

P63600/4760

Type:

Conference Proceedings

Details

TDL ID:	ZA00012597
Series ID:	PA00000029
Conf. info. (Name):	International Symposium on High-Power Laser Ablation
Conf. info. (Number):	2002 : 4th
Conf. info. (Venue):	Taos, NM, USA
Conf. info. (Date):	2002.04.22-2002.04.26

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